HiSilicon Kirin 655 vs Qualcomm Snapdragon 450. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 650 Qualcomm Snapdragon 450
• Family
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  4 4
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  4x Cortex-A53 -
• B-Core
  4x Cortex-A53 -
• Base Frequency
  1.7 GHz 1.8 GHz
• Core architecture
  hybrid (big.LITTLE) normal
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.12 GHz 1.8 GHz
• Turbo Frequency (8 Cores)
  2.12 GHz 1.8 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  11 11
• Execution units
  2 0
• Generation
  Midgard 4 5
• GPU Frequency
  900 MHz 600 MHz
• GPU name
  ARM Mali-T830 MP2 Qualcomm Adreno 506
• GPU Turbo
  900 MHz 600 MHz
• Max. displays
  2 0
• Release date
  Q4/2015 Q4/2015
• Shader
  32 96
• Technology
  28nm 14 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Conflicting source values: Decode / Encode | No Conflicting source values: Decode / Encode | No
• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode No
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  No Decode
• VP8
  Decode / Encode No
• VP9
  No No

Types, channel quantity of RAM supported by Qualcomm Snapdragon 450 and HiSilicon Kirin 655. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Memory channels
  2 1
• Memory type
  LPDDR3-933 LPDDR3-933

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 655 and Qualcomm Snapdragon 450 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 655 and Qualcomm Snapdragon 450, virtual machine technologies and process technology.

• Architecture
  Cortex-A53 / Cortex-A53 Cortex-A53
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Part Number
  - SDM450
• Release date
  Q2/2016 Q3/2017
• Technology
  16 nm 14 nm
• Virtualization
  None None