Qualcomm Snapdragon 7c Gen 2 vs AMD Ryzen 3 7320U. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Qualcomm Snapdragon AMD Ryzen 3
• CPU group
  Qualcomm Snapdragon 7c AMD Ryzen 7000U
• Segment
  Mobile Mobile
• Generation
  2 6
• Predecessor
  Qualcomm Snapdragon 7c --

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  8 / 8 4 / 8
• Core architecture
  hybrid (big.LITTLE) normal
• Frequency
  2.55 GHz 2.40 GHz
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 618 AMD Radeon 610M Graphics
• GPU frequency
  0.70 GHz 1.90 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  0 2
• Shader
  128 128
• Max. GPU Memory
  4 GB 8 GB
• Max. displays
  2 3
• Generation
  6 9
• Direct X
  12.1 12
• Technology
  14 nm 6 nm
• Release date
  Q2/2019 Q3/2022

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by AMD Ryzen 3 7320U and Qualcomm Snapdragon 7c Gen 2. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-2133 LPDDR5-5500
• Max. Memory
  16 GB
• Memory channels
  2 2 (Dual Channel)
• ECC
  No No
• PCIe
  3.0 x 4
• AES-NI
  No Yes

Compare the TDP requirements of TDP Qualcomm Snapdragon 7c Gen 2 and AMD Ryzen 3 7320U to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W
• TDP down
  -- 8 W
• Tjunction max.
  -- 100 °C

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 7c Gen 2 and Qualcomm Snapdragon 7c Gen 2, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• Architecture
  Kryo 468 Mendocino (Zen 2)
• Technology
  8 nm 6 nm
• Virtualization
  None AMD-V, SVM
• Socket
  N/A FT6
• Release date
  Q2/2021 Q3/2022
• Part Number
  SC7180P 100-000000676