Qualcomm Snapdragon 670 vs Qualcomm Snapdragon 850. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Qualcomm Snapdragon Qualcomm Snapdragon
• Generation
  6 5
• CPU group
  Qualcomm Snapdragon 670 Qualcomm Snapdragon 845

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.70 GHz 1.80 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.00 GHz 2.95 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  1.70 GHz 2.95 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Kryo 360 Gold 4x Kryo 385 Gold
• B core
  6x Kryo 360 Silver 4x Kryo 385 Silver

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 615 Qualcomm Adreno 630
• GPU frequency
  0.70 GHz 0.70 GHz
• GPU (Turbo)
  0.70 GHz No turbo
• Shader
  256 256
• Max. GPU Memory
  -- 8 GB
• Max. displays
  0 2
• Generation
  6 4
• DirectX Version
  12.1 11
• Technology
  10 nm 10 nm
• Release date
  Q2/2018 Q1/2018

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode Decode / Encode
• VP9
  Decode Decode
• VP8
  Decode Decode
• AV1
  No No
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 850 and Qualcomm Snapdragon 670. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-1866 LPDDR4X-1866
• Max. Memory
  8 GB
• ECC
  No No
• Memory channels
  2 4

• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 670 and Qualcomm Snapdragon 850 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 670 and Qualcomm Snapdragon 670, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Kryo 360 Kryo 385
• Technology
  10 nm 10 nm
• Socket
  N/A N/A
• Release date
  Q3/2018 Q3/2018
• Part Number
  SDM670 SDM850