AMD Ryzen Embedded V3C16 vs Intel Core i5-13400. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  AMD Ryzen Embedded V Intel Core i5
• CPU group
  AMD Ryzen Embedded V3000 Intel Core i 13000
• Segment
  Desktop / Server Desktop / Server
• Generation
  3 13
• Predecessor
  AMD Ryzen Embedded V2516 Intel Core i5-12400

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  6 / 12 10 / 16
• Core architecture
  normal hybrid (big.LITTLE)
• Hyperthreading / SMT
  Yes Yes
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  no iGPU Intel UHD Graphics 770
• GPU frequency
  0.30 GHz
• GPU (Turbo)
  No turbo 1.45 GHz
• Execution units
  32
• Shader
  256
• Max. GPU Memory
  -- 64 GB
• Max. displays
  3
• Generation
  11
• Direct X
  -- 12
• Technology
  10 nm
• Release date
  Q4/2021

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  No Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No Decode / Encode
• AV1
  No Decode
• AVC
  No Decode / Encode
• VC-1
  No Decode
• JPEG
  No Decode / Encode

Types, channel quantity of RAM supported by Intel Core i5-13400 and AMD Ryzen Embedded V3C16. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  DDR5-4800 DDR5-4800
• Max. Memory
  64 GB 128 GB
• Memory channels
  2 (Dual Channel) 2 (Dual Channel)
• Bandwidth
  76.8 GB/s 89.6 GB/s
• ECC
  Yes Yes
• PCIe
  4.0 x 20 5.0 x 20
• AES-NI
  Yes Yes

Compare the TDP requirements of TDP AMD Ryzen Embedded V3C16 and Intel Core i5-13400 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W 65 W
• TDP (PL2)
  -- 117 W
• TDP up
  25 W --
• TDP down
  10 W --
• Tjunction max.
  105 °C 100 °C

Architecture, interfaces, additional instructions supported by AMD Ryzen Embedded V3C16 and AMD Ryzen Embedded V3C16, virtual machine technologies and process technology.

• Technology
  6 nm 10 nm
• Chip design
  Chiplet Monolithic
• Socket
  FP7r2 LGA 1700
• L2-Cache
  3.00 MB 20.00 MB
• L3-Cache
  16.00 MB 20.00 MB
• Architecture
  Rembrandt (Zen 3+) Alder Lake S Refresh
• Operating systems
  Windows 10, Windows 11, Linux Windows 10, Windows 11, Linux
• Virtualization
  AMD-V, SVM VT-x, VT-x EPT, VT-d
• Instruction set (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4.1, SSE4.2, AVX2, AVX2+
• Release date
  Q3/2022 Q1/2023
• Documents
  Technical data sheet --