Intel Core i5-13400 vs AMD Ryzen Embedded V3C44. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Intel Core i5 AMD Ryzen Embedded V
• CPU group
  Intel Core i 13000 AMD Ryzen Embedded V3000
• Segment
  Desktop / Server Desktop / Server
• Generation
  13 3
• Predecessor
  Intel Core i5-12400 --

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  10 / 16 4 / 8
• Core architecture
  hybrid (big.LITTLE) normal
• Hyperthreading / SMT
  Yes Yes
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Intel UHD Graphics 770 no iGPU
• GPU frequency
  0.30 GHz
• GPU (Turbo)
  1.45 GHz No turbo
• Execution units
  32
• Shader
  256
• Max. GPU Memory
  64 GB --
• Max. displays
  3
• Generation
  11
• Direct X
  12 --
• Technology
  10 nm
• Release date
  Q4/2021

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode No
• h265 / HEVC (10 bit)
  Decode / Encode No
• h264
  Decode / Encode No
• VP8
  Decode / Encode No
• VP9
  Decode / Encode No
• AV1
  Decode No
• AVC
  Decode / Encode No
• VC-1
  Decode No
• JPEG
  Decode / Encode No

Types, channel quantity of RAM supported by AMD Ryzen Embedded V3C44 and Intel Core i5-13400. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  DDR5-4800 DDR5-4800
• Max. Memory
  128 GB 64 GB
• Memory channels
  2 (Dual Channel) 2 (Dual Channel)
• Bandwidth
  89.6 GB/s 76.8 GB/s
• ECC
  Yes Yes
• PCIe
  5.0 x 20 4.0 x 20
• AES-NI
  Yes Yes

Compare the TDP requirements of TDP Intel Core i5-13400 and AMD Ryzen Embedded V3C44 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  65 W 45 W
• TDP (PL2)
  117 W --
• TDP up
  -- 54 W
• TDP down
  -- 35 W
• Tjunction max.
  100 °C 105 °C

Architecture, interfaces, additional instructions supported by Intel Core i5-13400 and Intel Core i5-13400, virtual machine technologies and process technology.

• Technology
  10 nm 6 nm
• Chip design
  Monolithic Chiplet
• Socket
  LGA 1700 FP7r2
• L2-Cache
  20.00 MB 2.00 MB
• L3-Cache
  20.00 MB 8.00 MB
• Architecture
  Alder Lake S Refresh Rembrandt (Zen 3+)
• Operating systems
  Windows 10, Windows 11, Linux Windows 10, Windows 11, Linux
• Virtualization
  VT-x, VT-x EPT, VT-d AMD-V, SVM
• Instruction set (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4.1, SSE4.2, AVX2, AVX2+ SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• Release date
  Q1/2023 Q3/2022
• Documents
  -- Technical data sheet