AMD EPYC 9754 vs AMD Ryzen 9 7950X3D. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  AMD EPYC AMD Ryzen 9
• CPU group
  AMD EPYC 9004 AMD Ryzen 7000
• Segment
  Desktop / Server Desktop / Server
• Generation
  4 6

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  128 / 256 16 / 32
• Core architecture
  normal normal
• Cores
  128x Zen 4c 16x Zen 4
• Hyperthreading / SMT
  Yes Yes
• Overclocking
  No No
• Frequency
  2.25 GHz 4.20 GHz
• Turbo Frequency (1 Core)
  3.10 GHz 5.70 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  no iGPU AMD Radeon Graphics (Raphael)
• GPU frequency
  0.40 GHz
• GPU (Turbo)
  No turbo 2.20 GHz
• Execution units
  2
• Shader
  128
• Max. GPU Memory
  -- 8 GB
• Max. displays
  3
• Generation
  9
• Direct X
  -- 12
• Technology
  5 nm
• Release date
  Q3/2022

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  No Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No Decode / Encode
• AV1
  No No
• AVC
  No Decode / Encode
• VC-1
  No Decode
• JPEG
  No Decode / Encode

Types, channel quantity of RAM supported by AMD Ryzen 9 7950X3D and AMD EPYC 9754. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  DDR5-4800 DDR5-5200
• Max. Memory
  6144 GB 128 GB
• Memory channels
  12 2 (Dual Channel)
• Bandwidth
  461.0 GB/s 83.2 GB/s
• ECC
  Yes Yes
• PCIe
  5.0 x 128 5.0 x 24
• AES-NI
  Yes Yes

Compare the TDP requirements of TDP AMD EPYC 9754 and AMD Ryzen 9 7950X3D to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1 / PBP)
  360 W 120 W
• TDP (PL2)
  -- 162 W
• TDP up
  400 W --
• TDP down
  320 W --
• Tjunction max.
  100 °C 89 °C

Architecture, interfaces, additional instructions supported by AMD EPYC 9754 and AMD EPYC 9754, virtual machine technologies and process technology.

• Technology
  5 nm 5 nm
• Chip design
  Chiplet Chiplet
• Socket
  SP5 AM5 (LGA 1718)
• L2-Cache
  -- 16.00 MB
• L3-Cache
  256.00 MB 128.00 MB
• Architecture
  Bergamo (Zen 4c) Raphael (Zen 4)
• Operating systems
  Windows Server 2022, Linux, Windows 11 Windows 10, Windows 11, Linux
• Virtualization
  AMD-V, SVM AMD-V, SVM
• Instruction set (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4.2, AVX2, AVX-512, BFLOAT16, VNNI SSE4a, SSE4.1, SSE4.2,FMA3, AVX2, AVX512
• Release date
  Q2/2023 Q1/2023
• Release price
  11900 $ --
• Documents
  Technical data sheet Technical data sheet