AMD Ryzen AI Max+ 395 对 AMD Ryzen AI Max+ PRO 395. 规格

有关被比较的处理器、系列、代数和细分市场的背景信息。

• 系列
  Ryzen Ryzen PRO
• Form Factor
  Laptops / Desktops Laptops / Desktops
• 分段
  Mobile Mobile
• Series
  Ryzen AI Max 300 Series Ryzen AI Max PRO 300 Series

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• Base Frequency
  3 GHz 3 GHz
• CPU核数
  16 16
• CPU线程
  32 32
• Max. Boost Clock
  5.1 GHz 5.1 GHz

内部图形不影响CPU的性能，在没有显卡或在移动设备上执行显卡的工作。

• GPU Frequency
  2900 MHz 2900 MHz
• GPU名称
  Radeon 8060S Graphics Radeon 8060S Graphics
• Graphics Cores
  40 40

支持的RAM的类型、通道数量 AMD Ryzen AI Max+ PRO 395 和 AMD Ryzen AI Max+ 395. 根据主板的不同，可能支持更高或更低的内存频率。

• 存储器类型
  256-bit LPDDR5x 256-bit LPDDR5x
• PCIe
  PCIe 4.0 PCIe 4.0

比较TDP的要求 AMD Ryzen AI Max+ 395 和 AMD Ryzen AI Max+ PRO 395 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• Configurable TDP
  45-120 W 45-120 W
• Default TDP
  55 W 55 W
• Maximum Operating Temperature
  100 °C 100 °C

架构、接口、所支持的额外指令 AMD Ryzen AI Max+ 395 和 AMD Ryzen AI Max+ PRO 395, 虚拟机技术和工艺技术。

• Availability window (manufacturer)
  Q1 2025 Q1 2025
• Codename
  Strix Halo Strix Halo
• Date evidence scope
  Manufacturer-announced OEM/board availability window; exact first shipment is not established by this source. Manufacturer-announced OEM/board availability window; exact first shipment is not established by this source.
• L2-Cache
  16 MB 16 MB
• L2-Cache
  64 MB 64 MB
• 发布日期
  Q1/2025 Q1/2025
• 插座
  FP11 FP11
• 技术过程
  TSMC 4nm FinFET TSMC 4nm FinFET
• Verification scope
  Explicit manufacturer fields refreshed; other original historical fields retained, not all reverified. Partial composite conflicts are preserved. Explicit manufacturer fields refreshed; other original historical fields retained, not all reverified. Partial composite conflicts are preserved.