HiSilicon Kirin 960
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Released
Q4/2016
HiSilicon Kirin 960

Processor HiSilicon Kirin 960, specifications and benchmarks

HiSilicon Kirin 960 Processor is being reviewed, the release of which was held in Q4/2016. Here are all the HiSilicon Kirin 960’s specifications and performance estimation in benchmark. We offer to study all the data and compare it with a competing model. The base clock frequency of the model is 1.80 GHz, total of cores is 8. The CPU supports LPDDR4-1600 and is installed in the motherboard on Socket N/A. The TDP for CPU is 5 W.

Specifications

Technical data

Legacy catalog specifications; the original verification date is not recorded.

CPU generation and family
  • CPU group
    HiSilicon Kirin 960
  • Family
    HiSilicon Kirin
  • Generation
    5
  • Name
    HiSilicon Kirin 960
  • Predecessor
    —
  • Segment
    Mobile
  • Successor
    —
CPU Cores and Base Frequency
  • A-Core
    4x Cortex-A73
  • B-Core
    4x Cortex-A53
  • Base Frequency
    1.8 GHz
  • C-Core
    —
  • Core architecture
    hybrid (big.LITTLE)
  • CPU Cores
    8
  • CPU Threads
    8
  • Hyperthreading / SMT
    No
  • Overclocking
    No
  • Turbo Frequency (1 Core)
    2.4 GHz
  • Turbo Frequency (8 Cores)
    2.4 GHz
Internal Graphics
  • DirectX Version
    11
  • Execution units
    8
  • Generation
    Bifrost 1
  • GPU Frequency
    900 MHz
  • GPU name
    ARM Mali-G71 MP8
  • GPU Turbo
    No turbo
  • Max. displays
    2
  • Max. GPU Memory
    2 GB
  • Release date
    Q2/2016
  • Shader
    256
  • Technology
    16 nm
Hardware codec support
  • AV1
    No
  • H.264 / AVC
    Decode / Encode
  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Decode
  • JPEG
    Decode / Encode
  • VC-1
    No
  • VP8
    Decode / Encode
  • VP9
    No
Memory & PCIe
  • ECC
    No
  • Max. Memory
    6 GB
  • Memory channels
    2
  • Memory type
    LPDDR4-1600
  • PCIe lanes
    —
  • PCIe version
    —
Encryption
  • AES-NI
    No
Thermal Management
  • Maximum Operating Temperature
    —
  • TDP (PL1, legacy label)
    5 W
  • TDP (PL2)
    —
  • TDP down
    —
  • TDP up
    —
Technical details
  • Architecture
    Cortex-A73 / Cortex-A53
  • Instruction set (ISA)
    ARMv8-A64 (64 bit)
  • ISA extensions
    —
  • L2-Cache
    —
  • L3-Cache
    4.00 MB
  • Part Number
    —
  • Release date
    Q4/2016
  • Socket
    —
  • Technology
    16 nm
  • Virtualization
    None
Positions in all rankings

Common positions HiSilicon Kirin 960 CPU in popular benchmarks, for comparison with other models.

  • Geekbench 5, 64bit (Single-Core)
    1079 place
  • Geekbench 5, 64bit (Multi-Core)
    874 place
  • iGPU - FP32 Performance (Single-precision GFLOPS)
    1205 place

Benchmarks

Performance tests CPU

Compare the scores of popular benchmarks HiSilicon Kirin 960 with other processors to understand the real speed of the CPU when processing content.

Tests include mathematical calculations, creation of 3D models, cryptocurrency mining, tests in single and multi-core modes.

These are saved results from the earlier catalog. Measurement dates and test configurations were not recorded. Models with no comparable results are omitted.

Geekbench 5, 64bit (Single-Core)
Geekbench 5 SC is a popular cross-platform performance test for desktop or mobile processors that uses system memory intensively

Higher values are better in this metric.

381
HiSilicon Kirin 960
383
383
Geekbench 5, 64bit (Multi-Core)
Geekbench 5 MC is a popular cross-platform performance test for desktop or mobile processors that uses system memory intensively

Higher values are better in this metric.

1491
HiSilicon Kirin 960
1502
1501
iGPU - FP32 Performance (Single-precision GFLOPS)
The performance of the iGPU - the internal GPU in games

Higher values are better in this metric.

245 GFLOPS
HiSilicon Kirin 960
250 GFLOPS
246 GFLOPS

Comparable benchmark results are required to suggest performance alternatives.

*

PL1 is the sustained processor power limit; PL2 is the short-term turbo power limit. They are not measured performance or efficiency.

The values are used to select the optimal cooling system and power supply.

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HiSilicon Kirin 960

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