Qualcomm Snapdragon 8cx vs HiSilicon Kirin 985 5G. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Qualcomm Snapdragon HiSilicon Kirin
• CPU group
  Qualcomm Snapdragon 8cx HiSilicon Kirin 980
• Segment
  Mobile Mobile
• Generation
  3 7

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Core architecture
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• Frequency
  1.80 GHz 1.84 GHz
• Turbo (1 Core)
  2.84 GHz 2.40 GHz
• Turbo (8 Cores)
  2.84 GHz 2.58 GHz
• Hyperthreading
  No No
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 680 ARM Mali-G77 MP8
• GPU frequency
  0.25 GHz 0.80 GHz
• GPU (Turbo)
  0.59 GHz No turbo
• Execution units
  8 8
• Shader
  768 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 1
• Generation
  5 Vallhall 1
• Technology
  7 nm 7 nm
• Release date
  Q4/2018 Q2/2019

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 985 5G and Qualcomm Snapdragon 8cx. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-2133 LPDDR4X-2133
• Max. Memory
  16 GB
• Memory channels
  8 4
• ECC
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 8cx and HiSilicon Kirin 985 5G to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 8cx and Qualcomm Snapdragon 8cx, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  2.00 MB --
• Architecture
  Kryo 495 Cortex-A76 / Cortex-A55
• Technology
  7 nm 7 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q4/2018 Q2/2020
• Part Number
  -- Hi6290