Qualcomm Snapdragon 8 Gen 1 vs MediaTek Dimensity 9000 Plus. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Qualcomm Snapdragon Mediatek Dimensity
• CPU group
  Qualcomm Snapdragon 8 Gen 1 MediaTek Dimensity 9000
• Segment
  Mobile Mobile
• Generation
  1 3
• Predecessor
  Qualcomm Snapdragon 888 --

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  8 / 8 8 / 8
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  1x Cortex-X2 1x Cortex-X2
• B-Core
  3x Cortex-A710 3x Cortex-A710
• C-Core
  4x Cortex-A510 4x Cortex-A510
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 730 ARM Mali-G710 MP10
• GPU frequency
  0.84 GHz 0.90 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  -- 10
• Shader
  -- 0
• Max. displays
  -- 1
• Generation
  7 Vallhall 3
• Direct X
  12.1 12
• Technology
  4 nm 4 nm
• Release date
  Q1/2022 Q2/2021

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by MediaTek Dimensity 9000 Plus and Qualcomm Snapdragon 8 Gen 1. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR5-3200 LPDDR5-7500
• Max. Memory
  16 GB
• Memory channels
  4 4
• ECC
  No No
• PCIe
  --
• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 8 Gen 1 and MediaTek Dimensity 9000 Plus to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 8 Gen 1 and Qualcomm Snapdragon 8 Gen 1, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv9-A64 (64 bit) ARMv9-A64 (64 bit)
• ISA extensions
  --
• L2-Cache
  2.00 MB --
• L3-Cache
  4.00 MB --
• Architecture
  Kryo Cortex-X2 / -A710 / -A510
• Technology
  4 nm 4 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q1/2022 Q3/2022
• Part Number
  SM8450 MT6983