Qualcomm Snapdragon 888 vs Intel Core i7-1255U. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Qualcomm Snapdragon Intel Core i7
• Generation
  8 12
• CPU group
  Qualcomm Snapdragon 888 Intel Core i 1200P/1200U

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.80 GHz 1.70 GHz
• Turbo (1 Core)
  2.84 GHz 4.70 GHz
• Hyperthreading
  No Yes
• Overclocking
  No No
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 660 Intel Iris Xe Graphics 96 (Alder Lake)
• GPU frequency
  0.84 GHz 0.35 GHz
• GPU (Turbo)
  No turbo 1.25 GHz
• Execution units
  0 96
• Shader
  0 768
• Max. GPU Memory
  -- 64 GB
• Max. displays
  0 4
• Generation
  6 13
• Technology
  5 nm 10 nm
• Release date
  Q1/2021 Q1/2022

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Intel Core i7-1255U and Qualcomm Snapdragon 888. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-4266LPDDR5-3200 DDR4-3200DDR5-4800LPDDR4X-4266LPDDR5-5200
• Max. Memory
  64 GB
• ECC
  No No
• Memory channels
  4 2

Compare the TDP requirements of TDP Qualcomm Snapdragon 888 and Intel Core i7-1255U to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W
• TDP (PL2)
  -- 55 W
• Tjunction max.
  -- 100 °C

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 888 and Qualcomm Snapdragon 888, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• Virtualization
  None VT-x, VT-x EPT, VT-d
• ISA extensions
  SSE4.1, SSE4.2, AVX2
• L2-Cache
  1.00 MB 6.50 MB
• L3-Cache
  8.00 MB 12.00 MB
• Architecture
  Kryo 680 Alder Lake U
• Technology
  5 nm 10 nm
• Socket
  N/A BGA 1744
• Release date
  Q1/2021 Q1/2022