Qualcomm Snapdragon 855 Plus vs Qualcomm Snapdragon 8c. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPU group
  Qualcomm Snapdragon 855/860 Qualcomm Snapdragon 8c
• Segment
  Mobile Mobile
• Generation
  6 3
• Successor
  Qualcomm Snapdragon 860 --

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  8 / 8 8 / 8
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A-Core
  1x Kryo 485 Prime 4x Kryo 490 Gold
• B-Core
  3x Kryo 485 Gold 4x Kryo 490 Silver
• C-Core
  4x Kryo 485 Silver --
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 640 Qualcomm Adreno 675
• GPU frequency
  0.25 GHz 0.25 GHz
• GPU (Turbo)
  0.68 GHz 0.59 GHz
• Execution units
  4 7
• Shader
  384 672
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 1
• Generation
  5 5
• Direct X
  12.0 12.0
• Technology
  7 nm 7 nm
• Release date
  Q1/2019 Q4/2018

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• AV1
  No No
• AVC
  No Decode
• VC-1
  No Decode
• JPEG
  No Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 8c and Qualcomm Snapdragon 855 Plus. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-4266 LPDDR4X-4266
• Max. Memory
  16 GB 16 GB
• Memory channels
  4 4
• ECC
  No No
• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 855 Plus and Qualcomm Snapdragon 8c to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 855 Plus and Qualcomm Snapdragon 855 Plus, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  2.00 MB 2.00 MB
• L3-Cache
  3.00 MB 3.00 MB
• Architecture
  Kryo 485 Kryo 490
• Technology
  7 nm 7 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q4/2018 Q4/2019
• Part Number
  SM8150-AC --