Qualcomm Snapdragon 850 vs Qualcomm Snapdragon 670. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  Qualcomm Snapdragon 845 Qualcomm Snapdragon 670
• Family
  Qualcomm Snapdragon Qualcomm Snapdragon
• Generation
  5 6
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  4x Kryo 385 Gold 2x Kryo 360 Gold
• B-Core
  4x Kryo 385 Silver 6x Kryo 360 Silver
• Base Frequency
  1.8 GHz 1.7 GHz
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.95 GHz 2 GHz
• Turbo Frequency (8 Cores)
  2.95 GHz 1.7 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  11 12.1
• Execution units
  0 0
• Generation
  4 6
• GPU Frequency
  700 MHz 700 MHz
• GPU name
  Qualcomm Adreno 630 Qualcomm Adreno 615
• GPU Turbo
  No turbo 700 MHz
• Max. displays
  2 0
• Max. GPU Memory
  8 GB -
• Release date
  Q1/2018 Q2/2018
• Shader
  256 256
• Technology
  10 nm 10 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Conflicting source values: Decode | Decode / Encode Decode
• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• JPEG
  Decode / Encode Decode
• VC-1
  Decode Decode
• VP8
  Decode Decode
• VP9
  Decode Decode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 670 and Qualcomm Snapdragon 850. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  8 GB -
• Memory channels
  4 2
• Memory type
  LPDDR4X-1866 LPDDR4X-1866

• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 850 and Qualcomm Snapdragon 670 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 850 and Qualcomm Snapdragon 670, virtual machine technologies and process technology.

• Architecture
  Kryo 385 Kryo 360
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Part Number
  SDM850 SDM670
• Release date
  Q3/2018 Q3/2018
• Technology
  10 nm 10 nm
• Virtualization
  None None