Qualcomm Snapdragon 7c vs Intel Core i3-11100. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Qualcomm Snapdragon Intel Core i3
• CPU group
  Qualcomm Snapdragon 7c Intel Core i 11000
• Segment
  Mobile Desktop / Server
• Generation
  2 11
• Successor
  Qualcomm Snapdragon 7c Gen 2 --

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Core architecture
  hybrid (big.LITTLE) normal
• Frequency
  2.40 GHz 3.80 GHz
• Turbo (1 Core)
  2.40 GHz 4.50 GHz
• Hyperthreading
  No Yes
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 618 Intel UHD Graphics 630
• GPU frequency
  0.70 GHz 0.35 GHz
• GPU (Turbo)
  No turbo 1.10 GHz
• Execution units
  0 24
• Shader
  128 192
• Max. GPU Memory
  4 GB 64 GB
• Max. displays
  2 3
• Generation
  6 9.5
• Technology
  14 nm 14 nm
• Release date
  Q2/2019 Q4/2017

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  No No
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Intel Core i3-11100 and Qualcomm Snapdragon 7c. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-2133 DDR4-2933
• Max. Memory
  128 GB
• Memory channels
  2 2
• ECC
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 7c and Intel Core i3-11100 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  65 W
• Tjunction max.
  -- 100 °C

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 7c and Qualcomm Snapdragon 7c, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4.1, SSE4.2, AVX2, AVX-512
• L3-Cache
  -- 6.00 MB
• Architecture
  Kryo 468 Rocket Lake S
• Technology
  8 nm 14 nm
• Virtualization
  None VT-x, VT-x EPT, VT-d
• Socket
  N/A LGA 1200
• Release date
  2020 Q2/2021
• Part Number
  SC7180 --