Qualcomm Snapdragon 778G vs Intel Core i7-8550U. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Qualcomm Snapdragon Intel Core i7
• Generation
  4 8
• CPU group
  Qualcomm Snapdragon 778 Intel Core i 8000U

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.90 GHz 1.80 GHz
• CPU Cores
  8 4
• Turbo (1 Core)
  2.40 GHz 4.00 GHz
• CPU Threads
  8 8
• Hyperthreading
  No Yes
• Overclocking
  No No
• Core architecture
  hybrid (Prime / big.LITTLE) normal
• A core
  1x Kryo 670 Prime --
• B core
  3x Kryo 670 Gold --
• C core
  4x Kryo 670 Silver --

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 642L Intel UHD Graphics 620
• GPU frequency
  0.30 GHz
• GPU (Turbo)
  No turbo 1.15 GHz
• Execution units
  4 24
• Shader
  384 192
• Max. GPU Memory
  4 GB 64 GB
• Max. displays
  1 3
• Generation
  5 9.5
• DirectX Version
  12.0 12
• Technology
  6 nm 14 nm
• Release date
  Q2/2021 Q3/2016

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  No No
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Intel Core i7-8550U and Qualcomm Snapdragon 778G. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-2133 DDR4-2400 SO-DIMM
• Max. Memory
  16 GB 32 GB
• ECC
  No No
• Memory channels
  2 2
• PCIe version
  3.0
• PCIe lanes
  12

• AES-NI
  No Yes

Compare the TDP requirements of TDP Qualcomm Snapdragon 778G and Intel Core i7-8550U to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 778G and Qualcomm Snapdragon 778G, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• Virtualization
  None VT-x, VT-x EPT, VT-d
• ISA extensions
  SSE4.1, SSE4.2, AVX2
• L3-Cache
  2.00 MB 8.00 MB
• Architecture
  Kryo 670 Kaby Lake U Refresh
• Technology
  6 nm 14 nm
• Socket
  N/A BGA 1356
• Release date
  Q2/2021 Q3/2017
• Part Number
  SM7325 --