Qualcomm Snapdragon 765 vs Intel Core i5-1030NG7. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Qualcomm Snapdragon Intel Core i5
• CPU group
  Qualcomm Snapdragon 760 Intel Core i 1000G/10000U
• Segment
  Mobile Mobile
• Generation
  3 10

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Core architecture
  hybrid (big.LITTLE) normal
• Frequency
  1.80 GHz 1.10 GHz
• Turbo (1 Core)
  2.30 GHz 3.50 GHz
• Hyperthreading
  No Yes
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 620 Intel Iris Plus Graphics (Ice Lake G7)
• GPU frequency
  0.63 GHz 0.30 GHz
• GPU (Turbo)
  No turbo 1.05 GHz
• Execution units
  0 64
• Shader
  192 512
• Max. GPU Memory
  4 GB --
• Max. displays
  2 3
• Generation
  6 11
• Technology
  7 nm 14 nm
• Release date
  Q2/2019 Q3/2019

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  No No
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Intel Core i5-1030NG7 and Qualcomm Snapdragon 765. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4-3733 LPDDR4-3733
• Max. Memory
  8 GB 32 GB
• Memory channels
  2 2
• ECC
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 765 and Intel Core i5-1030NG7 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W 10 W
• Tjunction max.
  -- 100 °C

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 765 and Qualcomm Snapdragon 765, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4.1, SSE4.2, AVX2
• L3-Cache
  2.00 MB 6.00 MB
• Architecture
  Kryo 475 Ice Lake U
• Technology
  7 nm 10 nm
• Virtualization
  None VT-x, VT-x EPT, VT-d
• Socket
  N/A BGA 1526
• Release date
  Q3/2020 Q2/2020
• Part Number
  SM7250-AA --