Qualcomm Snapdragon 665 vs MediaTek Helio G96. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Qualcomm Snapdragon Mediatek Helio
• Generation
  7 1
• CPU group
  Qualcomm Snapdragon 662/665 MediaTek Helio G90

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.80 GHz 2.00 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.00 GHz 2.05 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  1.80 GHz 2.00 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Kryo 260 Gold 2x Cortex-A76
• B core
  4x Kryo 260 Silver 6x Cortex-A55

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 610 ARM Mali-G57 MP2
• GPU frequency
  0.90 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  0 2
• Shader
  128 32
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  0 2
• Generation
  6 Vallhall 1
• DirectX Version
  12.1 12
• Technology
  11 nm 7 nm
• Release date
  Q2/2019 Q2/2020

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by MediaTek Helio G96 and Qualcomm Snapdragon 665. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR3-1866LPDDR4X-1866 LPDDR4X-2133
• Max. Memory
  10 GB
• ECC
  No No
• Memory channels
  2 2
• PCIe version
  --
• PCIe lanes
  --

• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 665 and MediaTek Helio G96 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 665 and Qualcomm Snapdragon 665, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• ISA extensions
  --
• Architecture
  Kryo 260 Cortex-A76 / Cortex-A55
• Technology
  11 nm 12 nm
• Socket
  N/A N/A
• Release date
  Q2/2019 Q3/2021
• Part Number
  SM6125 --