Qualcomm Snapdragon 412 vs Qualcomm Snapdragon 865 Plus. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPU group
  Qualcomm Snapdragon 410 Qualcomm Snapdragon 865/870
• Segment
  Mobile Mobile
• Generation
  2 7

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  4 / 4 8 / 8
• Core architecture
  normal hybrid (Prime / big.LITTLE)
• A-Core
  -- 1x Kryo 585 Prime
• B-Core
  -- 3x Kryo 585 Gold
• C-Core
  -- 4x Kryo 585 Silver
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 306 Qualcomm Adreno 650
• GPU frequency
  0.40 GHz 0.25 GHz
• GPU (Turbo)
  0.40 GHz 0.67 GHz
• Execution units
  0 2
• Shader
  24 512
• Max. displays
  0 1
• Generation
  3 6
• Direct X
  11 12.0
• Technology
  28 nm 7 nm
• Release date
  Q3/2012 Q4/2019

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No Decode / Encode
• AV1
  No No
• AVC
  No Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 865 Plus and Qualcomm Snapdragon 412. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR2-600LPDDR3-600 LPDDR4X-4266LPDDR5-5500
• Max. Memory
  16 GB
• Memory channels
  1 4
• ECC
  No No
• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 412 and Qualcomm Snapdragon 865 Plus to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  10 W

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 412 and Qualcomm Snapdragon 412, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 3.00 MB
• Architecture
  Cortex-A53 Kryo 585
• Technology
  28 nm 7 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q3/2015 Q3/2020
• Part Number
  MSM8916 v2 SM8250-AB