MediaTek Helio P70 vs MediaTek Dimensity 8100. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  MediaTek Helio P60/P70 MediaTek Dimensity 8000
• Family
  Mediatek Helio Mediatek Dimensity
• Generation
  3 3
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  4x Cortex-A73 4x Cortex-A78
• A-Core Frequency
  1.90 GHz (2.10 GHz) 2.00 GHz (2.85 GHz)
• B-Core
  4x Cortex-A53 4x Cortex-A55
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 12
• Execution units
  3 6
• Generation
  Bifrost 2 Vallhall 3
• GPU Frequency
  900 MHz -
• GPU name
  ARM Mali-G72 MP3 ARM Mali-G610 MP6
• GPU Turbo
  No turbo No turbo
• Max. displays
  1 1
• Max. GPU Memory
  2 GB -
• Release date
  Q3/2017 Q2/2021
• Shader
  48 0
• Technology
  16 nm 4 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No Decode
• H.264 / AVC
  Decode / Encode Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by MediaTek Dimensity 8100 and MediaTek Helio P70. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  8 GB -
• Memory channels
  2 4
• Memory type
  LPDDR4X-1800 LPDDR5-6400

• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Helio P70 and MediaTek Dimensity 8100 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by MediaTek Helio P70 and MediaTek Dimensity 8100, virtual machine technologies and process technology.

• Architecture
  Cortex-A73 / Cortex-A53 Cortex-A78 / Cortex-A55
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Operating systems
  Android Android
• Release date
  Q2/2020 Q1/2022
• Technology
  12 nm 5 nm
• Virtualization
  None None