MediaTek Dimensity 8100 vs Apple M1 Pro (10-CPU 14-GPU). Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Mediatek Dimensity Apple M series
• CPU group
  MediaTek Dimensity 8000 Apple M1
• Segment
  Mobile Mobile
• Generation
  3 1

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  8 / 8 10 / 10
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  4x Cortex-A78 8x Firestorm
• B-Core
  4x Cortex-A55 2x Icestorm
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-G610 MP6 Apple M1 Pro (14 Core)
• GPU frequency
  1.30 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  6 224
• Shader
  0 1792
• Max. GPU Memory
  -- 32 GB
• Max. displays
  1 3
• Generation
  Vallhall 3 1
• Direct X
  12 --
• Technology
  4 nm 5 nm
• Release date
  Q2/2021 Q3/2021

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Apple M1 Pro (10-CPU 14-GPU) and MediaTek Dimensity 8100. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR5-6400 LPDDR5-6400
• Max. Memory
  32 GB
• Memory channels
  4 2
• ECC
  No No
• PCIe
  4.0
• AES-NI
  No Yes

Compare the TDP requirements of TDP MediaTek Dimensity 8100 and Apple M1 Pro (10-CPU 14-GPU) to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  30 W
• TDP up
  -- 40 W

Architecture, interfaces, additional instructions supported by MediaTek Dimensity 8100 and MediaTek Dimensity 8100, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• ISA extensions
  Rosetta 2 x86-Emulation
• L2-Cache
  -- 28.00 MB
• Architecture
  Cortex-A78 / Cortex-A55 M1
• Technology
  5 nm 5 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q1/2022 Q3/2021
• Part Number
  -- APL 1103