MediaTek Helio G70 vs Qualcomm Snapdragon 690. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  MediaTek Helio G70/G80 Qualcomm Snapdragon 690
• Family
  Mediatek Helio Qualcomm Snapdragon
• Generation
  1 8
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  2x Cortex-A75 2x Kryo 560 Gold
• B-Core
  6x Cortex-A55 6x Kryo 560 Silver
• Base Frequency
  1.7 GHz 1.7 GHz
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2 GHz 2 GHz
• Turbo Frequency (8 Cores)
  1.7 GHz 1.7 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 12.1
• Execution units
  2 0
• Generation
  Bifrost 2 6
• GPU Frequency
  820 MHz 950 MHz
• GPU name
  ARM Mali-G52 MP2 Qualcomm Adreno 619L
• GPU Turbo
  No turbo No turbo
• Max. displays
  2 0
• Release date
  Q3/2020 Q4/2020
• Shader
  32 0
• Technology
  16 nm 8 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Decode / Encode Decode
• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• VP9
  Decode / Encode Decode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 690 and MediaTek Helio G70. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  8 GB -
• Memory channels
  2 2
• Memory type
  LPDDR4X-1800 LPDDR4X-1866

• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Helio G70 and Qualcomm Snapdragon 690 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by MediaTek Helio G70 and Qualcomm Snapdragon 690, virtual machine technologies and process technology.

• Architecture
  Cortex-A75 / Cortex-A55 Kryo 560
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Part Number
  MT6769V/CB SM6350
• Release date
  Q1/2020 Q4/2020
• Technology
  12 nm 8 nm
• Virtualization
  None None