MediaTek Helio G70 vs MediaTek Dimensity 810. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  MediaTek Helio G70/G80 MediaTek Dimensity 810
• Family
  Mediatek Helio Mediatek Dimensity
• Generation
  1 2
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  2x Cortex-A75 4x Cortex-A76
• B-Core
  6x Cortex-A55 4x Cortex-A55
• Base Frequency
  1.7 GHz 2 GHz
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2 GHz 2.4 GHz
• Turbo Frequency (8 Cores)
  1.7 GHz 2 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 12
• Execution units
  2 2
• Generation
  Bifrost 2 Vallhall 1
• GPU Frequency
  820 MHz 900 MHz
• GPU name
  ARM Mali-G52 MP2 ARM Mali-G57 MP2
• GPU Turbo
  No turbo No turbo
• Max. displays
  2 2
• Max. GPU Memory
  - 4 GB
• Release date
  Q3/2020 Q2/2020
• Shader
  32 32
• Technology
  16 nm 7 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No Decode
• H.264 / AVC
  Decode / Encode Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by MediaTek Dimensity 810 and MediaTek Helio G70. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  8 GB 16 GB
• Memory channels
  2 2
• Memory type
  LPDDR4X-1800 LPDDR4X-2133

• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Helio G70 and MediaTek Dimensity 810 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by MediaTek Helio G70 and MediaTek Dimensity 810, virtual machine technologies and process technology.

• Architecture
  Cortex-A75 / Cortex-A55 Cortex-A76 / Cortex-A55
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Part Number
  MT6769V/CB -
• Release date
  Q1/2020 Q3/2021
• Technology
  12 nm 6 nm
• Virtualization
  None None