MediaTek Dimensity 930 vs Qualcomm Snapdragon 8 Gen 1. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Mediatek Dimensity Qualcomm Snapdragon
• CPU group
  MediaTek Dimensity 900 Qualcomm Snapdragon 8 Gen 1
• Segment
  Mobile Mobile
• Generation
  2 1
• Predecessor
  -- Qualcomm Snapdragon 888

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  8 / 8 8 / 8
• Core architecture
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  2x Cortex-A78 1x Cortex-X2
• B-Core
  6x Cortex-A55 3x Cortex-A710
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  PowerVR IMG AXM-8-256 Qualcomm Adreno 730
• GPU frequency
  1.00 GHz 0.84 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  8 --
• Shader
  0 --
• Max. displays
  0 --
• Generation
  10 7
• Direct X
  -- 12.1
• Technology
  0 4 nm
• Release date
  Q4/2019 Q1/2022

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No Decode / Encode
• AV1
  No No
• AVC
  No Decode
• VC-1
  No Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 8 Gen 1 and MediaTek Dimensity 930. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR5-6400 LPDDR5-3200
• Max. Memory
  16 GB 16 GB
• Memory channels
  4 (Quad Channel) 4
• ECC
  No No
• PCIe
  --
• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Dimensity 930 and Qualcomm Snapdragon 8 Gen 1 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

Architecture, interfaces, additional instructions supported by MediaTek Dimensity 930 and MediaTek Dimensity 930, virtual machine technologies and process technology.

• Technology
  6 nm 4 nm
• Socket
  -- N/A
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• Architecture
  Cortex-A78 / Cortex-A55 Kryo
• Virtualization
  None None
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• ISA extensions
  --
• Release date
  Q3/2022 Q1/2022
• Part Number
  MT6878 SM8450