MediaTek Dimensity 930 vs Apple M1 Pro (10-CPU 16-GPU). Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Mediatek Dimensity Apple M series
• CPU group
  MediaTek Dimensity 900 Apple M1
• Segment
  Mobile Mobile
• Generation
  2 1

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  8 / 8 10 / 10
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  2x Cortex-A78 8x Firestorm
• B-Core
  6x Cortex-A55 2x Icestorm
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  PowerVR IMG AXM-8-256 Apple M1 Pro (16 Core)
• GPU frequency
  1.00 GHz 1.30 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  8 256
• Shader
  0 2048
• Max. GPU Memory
  -- 16 GB
• Max. displays
  0 3
• Generation
  10 1
• Technology
  0 5 nm
• Release date
  Q4/2019 Q3/2021

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  No Decode
• VP9
  No Decode / Encode
• AV1
  No No
• AVC
  No Decode
• VC-1
  No Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Apple M1 Pro (10-CPU 16-GPU) and MediaTek Dimensity 930. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR5-6400 LPDDR5-6400
• Max. Memory
  16 GB 32 GB
• Memory channels
  4 (Quad Channel) 2
• ECC
  No No
• PCIe
  4.0
• AES-NI
  No Yes

Compare the TDP requirements of TDP MediaTek Dimensity 930 and Apple M1 Pro (10-CPU 16-GPU) to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP up
  -- 40 W

Architecture, interfaces, additional instructions supported by MediaTek Dimensity 930 and MediaTek Dimensity 930, virtual machine technologies and process technology.

• Technology
  6 nm 5 nm
• Socket
  -- N/A
• L2-Cache
  -- 28.00 MB
• Architecture
  Cortex-A78 / Cortex-A55 M1
• Virtualization
  None None
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• ISA extensions
  Rosetta 2 x86-Emulation
• Release date
  Q3/2022 Q3/2021
• Part Number
  MT6878 APL 1103