MediaTek Dimensity 930 vs Qualcomm Snapdragon 765G. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  MediaTek Dimensity 900 Qualcomm Snapdragon 760
• Family
  Mediatek Dimensity Qualcomm Snapdragon
• Generation
  2 3
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  2x Cortex-A78 1x Kryo 475 Prime
• A-Core Frequency
  2.2 GHz -
• B-Core
  6x Cortex-A55 1x Kryo 475 Gold
• B-Core Frequency
  2 GHz -
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Base Frequency
  - 1.8 GHz
• C-Core
  - 6x Kryo 475 Silver
• Turbo Frequency (1 Core)
  - 2.4 GHz
• Turbo Frequency (8 Cores)
  - 2.2 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  - 12.1
• Execution units
  8 0
• Generation
  10 6
• GPU Frequency
  1000 MHz 750 MHz
• GPU name
  PowerVR IMG AXM-8-256 Qualcomm Adreno 620
• GPU Turbo
  No turbo No turbo
• Max. displays
  0 2
• Max. GPU Memory
  - 4 GB
• Release date
  Q4/2019 Q2/2019
• Shader
  0 192
• Technology
  0 7 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Conflicting source values: Decode / Encode | No Conflicting source values: Decode | Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  No Decode
• VP8
  No Decode
• VP9
  No Decode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 765G and MediaTek Dimensity 930. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  16 GB 8 GB
• Memory Bandwidth
  18.4 GB/s -
• Memory channels
  4 (Quad Channel) 2
• Memory type
  LPDDR5-6400 LPDDR4-3733

• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Dimensity 930 and Qualcomm Snapdragon 765G Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  - 5 W

Architecture, interfaces, additional instructions supported by MediaTek Dimensity 930 and Qualcomm Snapdragon 765G, virtual machine technologies and process technology.

• Architecture
  Cortex-A78 / Cortex-A55 Kryo 475
• Chip design
  Chiplet -
• Documents
  Technical data sheet -
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  - 2 MB
• Operating systems
  Android -
• Part Number
  MT6878 SM7250-AB
• Release date
  Q3/2022 Q3/2020
• Technology
  6 nm 7 nm
• Virtualization
  None None