MediaTek Dimensity 820 vs MediaTek Helio G25. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Mediatek Dimensity Mediatek Helio
• Generation
  1 1
• CPU group
  MediaTek Dimensity 820 MediaTek Helio G25/G35

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A76 4x Cortex-A53
• B core
  4x Cortex-A55 4x Cortex-A53

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-G57 MP5 PowerVR GE8320
• GPU frequency
  0.90 GHz 0.65 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  5 1
• Shader
  80 --
• Max. GPU Memory
  4 GB --
• Max. displays
  2 1
• Generation
  Vallhall 1 --
• DirectX Version
  12 10
• Technology
  7 nm 20 nm
• Release date
  Q2/2020 Q1/2017

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode No
• h265 / HEVC (10 bit)
  Decode / Encode No
• h264
  Decode / Encode No
• VP9
  Decode / Encode No
• VP8
  Decode / Encode No
• AV1
  Decode No
• AVC
  Decode / Encode No
• VC-1
  Decode / Encode No
• JPEG
  Decode / Encode No

Types, channel quantity of RAM supported by MediaTek Helio G25 and MediaTek Dimensity 820. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-2133 LPDDR3-933LPDDR4X-1600
• Max. Memory
  16 GB 6 GB
• ECC
  No No
• Memory channels
  2 1
• PCIe version
  --
• PCIe lanes
  --

• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Dimensity 820 and MediaTek Helio G25 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Architecture, interfaces, additional instructions supported by MediaTek Dimensity 820 and MediaTek Dimensity 820, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• ISA extensions
  --
• Architecture
  Cortex-A76 / Cortex-A55 Cortex-A53 / Cortex-A53
• Technology
  7 nm 12 nm
• Socket
  N/A N/A
• Release date
  Q2/2020 Q2/2020
• Part Number
  MT6875 MT6762G