MediaTek Dimensity 700 vs HiSilicon Kirin 820E 5G. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  MediaTek Dimensity 700/720/800 HiSilicon Kirin 810/820
• Family
  Mediatek Dimensity HiSilicon Kirin
• Generation
  1 6
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  2x Cortex-A76 3x Cortex-A76
• B-Core
  6x Cortex-A55 3x Cortex-A55
• Base Frequency
  2 GHz 1.84 GHz
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.2 GHz 2.22 GHz
• Turbo Frequency (8 Cores)
  2 GHz 1.84 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 12
• Execution units
  2 6
• Generation
  Vallhall 1 Vallhall 1
• GPU Frequency
  850 MHz 850 MHz
• GPU name
  ARM Mali-G57 MP2 ARM Mali-G57 MP6
• GPU Turbo
  No turbo No turbo
• Max. displays
  2 2
• Max. GPU Memory
  4 GB 4 GB
• Release date
  Q2/2020 Q2/2020
• Shader
  32 96
• Technology
  7 nm 7 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  Decode Decode
• H.264 / AVC
  Decode / Encode Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 820E 5G and MediaTek Dimensity 700. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  12 GB -
• Memory channels
  2 4
• Memory type
  LPDDR4X-2133 LPDDR4X-2133

• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Dimensity 700 and HiSilicon Kirin 820E 5G Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  - 6 W

Architecture, interfaces, additional instructions supported by MediaTek Dimensity 700 and HiSilicon Kirin 820E 5G, virtual machine technologies and process technology.

• Architecture
  Cortex-A76 / Cortex-A55 Cortex-A76 / Cortex-A55
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  - 2.00 MB
• Part Number
  MT6833V/ZA -
• Release date
  Q1/2021 Q1/2021
• Technology
  7 nm 7 nm
• Virtualization
  None None