MediaTek Dimensity 1000C vs Qualcomm Snapdragon 850. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  MediaTek Dimensity 1000 Qualcomm Snapdragon 845
• Family
  Mediatek Dimensity Qualcomm Snapdragon
• Generation
  1 5
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  4x Cortex-A77 4x Kryo 385 Gold
• B-Core
  4x Cortex-A55 4x Kryo 385 Silver
• Base Frequency
  2 GHz 1.8 GHz
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2 GHz 2.95 GHz
• Turbo Frequency (8 Cores)
  2 GHz 2.95 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 11
• Execution units
  5 0
• Generation
  Vallhall 1 4
• GPU Frequency
  950 MHz 700 MHz
• GPU name
  ARM Mali-G57 MP5 Qualcomm Adreno 630
• GPU Turbo
  No turbo No turbo
• Max. displays
  2 2
• Max. GPU Memory
  4 GB 8 GB
• Release date
  Q2/2020 Q1/2018
• Shader
  80 256
• Technology
  7 nm 10 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  Decode No
• H.264 / AVC
  Decode / Encode Conflicting source values: Decode | Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• VP9
  Decode / Encode Decode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 850 and MediaTek Dimensity 1000C. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  12 GB 8 GB
• Memory channels
  4 4
• Memory type
  LPDDR4X-1866 LPDDR4X-1866

• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Dimensity 1000C and Qualcomm Snapdragon 850 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by MediaTek Dimensity 1000C and Qualcomm Snapdragon 850, virtual machine technologies and process technology.

• Architecture
  Cortex-A77 / Cortex-A55 Kryo 385
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Part Number
  MT6883Z/CZA SDM850
• Release date
  Q3/2020 Q3/2018
• Technology
  7 nm 10 nm
• Virtualization
  None None