HiSilicon Kirin 9000 vs Qualcomm Snapdragon 855. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  HiSilicon Kirin 9000 Qualcomm Snapdragon 855/860
• Family
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  9 6
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  1x Cortex-A77 1x Kryo 485 Prime
• B-Core
  3x Cortex-A77 3x Kryo 485 Gold
• Base Frequency
  2.05 GHz 1.8 GHz
• C-Core
  4x Cortex-A55 4x Kryo 485 Silver
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Turbo Frequency (1 Core)
  3.13 GHz 2.84 GHz
• Turbo Frequency (8 Cores)
  2.54 GHz 2.42 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 12.0
• Execution units
  24 4
• Generation
  Vallhall 2 5
• GPU Frequency
  760 MHz 250 MHz
• GPU name
  ARM Mali-G78 MP24 Qualcomm Adreno 640
• GPU Turbo
  No turbo 590 MHz
• Max. displays
  1 1
• Max. GPU Memory
  - 4 GB
• Release date
  Q4/2020 Q1/2019
• Shader
  384 384
• Technology
  5 nm 7 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  Decode No
• H.264 / AVC
  Decode / Encode Conflicting source values: Decode / Encode | No
• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode No
• VC-1
  Decode / Encode No
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 855 and HiSilicon Kirin 9000. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  - 16 GB
• Memory channels
  4 4
• Memory type
  LPDDR4X-2133LPDDR5-2750 LPDDR4X-4266

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 9000 and Qualcomm Snapdragon 855 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 9000 and Qualcomm Snapdragon 855, virtual machine technologies and process technology.

• Architecture
  Cortex-A77 / Cortex-A55 Kryo 485
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  - 2 MB
• L3-Cache
  - 3 MB
• Part Number
  - SM8150
• Release date
  Q4/2020 Q4/2018
• Technology
  5 nm 7 nm
• Virtualization
  None None