AMD A4-1200 vs HiSilicon Kirin 9000. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  AMD A HiSilicon Kirin
• Generation
  7 9
• CPU group
  AMD A4-1000 HiSilicon Kirin 9000

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.00 GHz 2.05 GHz
• CPU Cores
  2 8
• Turbo (1 Core)
  No turbo 3.13 GHz
• CPU Threads
  2 8
• Hyperthreading
  No No
• Overclocking
  Yes No
• Core architecture
  normal hybrid (Prime / big.LITTLE)
• A core
  -- 1x Cortex-A77
• B core
  -- 3x Cortex-A77
• C core
  -- 4x Cortex-A55

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  AMD Radeon HD 8180 ARM Mali-G78 MP24
• GPU frequency
  0.23 GHz 0.76 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  2 24
• Shader
  128 384
• Max. GPU Memory
  2 GB --
• Max. displays
  2 1
• Generation
  5 Vallhall 2
• DirectX Version
  11.1 12
• Technology
  28 nm 5 nm
• Release date
  Q2/2013 Q4/2020

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  Decode Decode / Encode
• VP9
  No Decode / Encode
• VP8
  No Decode / Encode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 9000 and AMD A4-1200. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  DDR3L-1066 SO-DIMM LPDDR4X-2133LPDDR5-2750
• Max. Memory
  --
• ECC
  No No
• Memory channels
  2 4
• PCIe version
  --
• PCIe lanes
  --

• AES-NI
  Yes No

Compare the TDP requirements of TDP AMD A4-1200 and HiSilicon Kirin 9000 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  3.9 W

Architecture, interfaces, additional instructions supported by AMD A4-1200 and AMD A4-1200, virtual machine technologies and process technology.

• Instruction set (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  AMD-V None
• ISA extensions
  SSE4a, SSE4.1, SSE4.2, AVX, FMA3, FMA4
• L3-Cache
  1.00 MB --
• Architecture
  Temash (Jaguar) Cortex-A77 / Cortex-A55
• Technology
  28 nm 5 nm
• Socket
  FT3 N/A
• Release date
  Q2/2013 Q4/2020