Qualcomm Snapdragon 855 Plus vs Intel Core i5-1130G7. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Qualcomm Snapdragon Intel Core i5
• CPU group
  Qualcomm Snapdragon 855/860 Intel Core i 1100G/11000U
• Segment
  Mobile Mobile
• Generation
  6 11
• Successor
  Qualcomm Snapdragon 860 --

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Core architecture
  hybrid (Prime / big.LITTLE) normal
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 640 Intel Iris Xe Graphics 80 (Tiger Lake G7)
• GPU frequency
  0.25 GHz 0.40 GHz
• GPU (Turbo)
  0.68 GHz 1.10 GHz
• Execution units
  4 80
• Shader
  384 640
• Max. GPU Memory
  4 GB 16 GB
• Max. displays
  1 4
• Generation
  5 12
• Technology
  7 nm 10 nm
• Release date
  Q1/2019 Q3/2020

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode
• VP9
  Decode / Encode Decode / Encode
• AV1
  No Decode
• AVC
  No Decode / Encode
• VC-1
  No Decode
• JPEG
  No Decode / Encode

Types, channel quantity of RAM supported by Intel Core i5-1130G7 and Qualcomm Snapdragon 855 Plus. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-4266 LPDDR4X-4266
• Max. Memory
  16 GB 32 GB
• Memory channels
  4 2
• ECC
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 855 Plus and Intel Core i5-1130G7 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W
• TDP down
  -- 7 W
• Tjunction max.
  -- 100 °C

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 855 Plus and Qualcomm Snapdragon 855 Plus, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4.1, SSE4.2, AVX2, AVX-512
• L2-Cache
  2.00 MB --
• L3-Cache
  3.00 MB 8.00 MB
• Architecture
  Kryo 485 Tiger Lake U
• Technology
  7 nm 10 nm
• Virtualization
  None VT-x, VT-x EPT, VT-d
• Socket
  N/A BGA 1526
• Release date
  Q4/2018 Q3/2020
• Part Number
  SM8150-AC --