MediaTek Dimensity 1200 vs Qualcomm Snapdragon 765G. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Mediatek Dimensity Qualcomm Snapdragon
• Generation
  2 3
• CPU group
  MediaTek Dimensity 1100/1200 Qualcomm Snapdragon 760

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  2.00 GHz 1.80 GHz
• Turbo (1 Core)
  3.00 GHz 2.40 GHz
• Turbo (8 Cores)
  2.60 GHz 2.20 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-G77 MP9 Qualcomm Adreno 620
• GPU frequency
  0.85 GHz 0.75 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  9 0
• Shader
  144 192
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 2
• Generation
  Vallhall 1 6
• Technology
  7 nm 7 nm
• Release date
  Q2/2019 Q2/2019

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  Decode No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 765G and MediaTek Dimensity 1200. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-2133 LPDDR4-3733
• Max. Memory
  8 GB
• ECC
  No No
• Memory channels
  4 2

Compare the TDP requirements of TDP MediaTek Dimensity 1200 and Qualcomm Snapdragon 765G to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Architecture, interfaces, additional instructions supported by MediaTek Dimensity 1200 and MediaTek Dimensity 1200, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L3-Cache
  -- 2.00 MB
• Architecture
  Cortex-A78 / Cortex-A55 Kryo 475
• Technology
  6 nm 7 nm
• Socket
  N/A N/A
• Release date
  Q1/2021 Q3/2020
• Part Number
  MT6893 SM7250-AB