HiSilicon Kirin 925 vs HiSilicon Kirin 990 5G. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  HiSilicon Kirin HiSilicon Kirin
• Generation
  2 8
• CPU group
  HiSilicon Kirin 920 HiSilicon Kirin 990

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.30 GHz 1.95 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  1.80 GHz 2.36 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  1.80 GHz 2.86 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A core
  4x Cortex-A15 2x Cortex-A76
• B core
  4x Cortex-A7 2x Cortex-A76
• C core
  -- 4x Cortex-A55

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-T628 MP4 ARM Mali-G76 MP16
• GPU frequency
  0.60 GHz 0.60 GHz
• GPU (Turbo)
  0.60 GHz No turbo
• Execution units
  4 16
• Shader
  64 256
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 2
• Generation
  Midgard 2 Bifrost 3
• DirectX Version
  11 12
• Technology
  32nm 7 nm
• Release date
  Q4/2012 Q3/2018

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  No Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  No No
• AVC
  No Decode / Encode
• VC-1
  No Decode / Encode
• JPEG
  No Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 990 5G and HiSilicon Kirin 925. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR3-1600 LPDDR4X-4266
• Max. Memory
  8 GB
• ECC
  No No
• Memory channels
  2 4

• AES-NI
  No No

Compare the TDP requirements of TDP HiSilicon Kirin 925 and HiSilicon Kirin 990 5G to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 925 and HiSilicon Kirin 925, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv7-A32 (32 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L3-Cache
  -- 2.00 MB
• Architecture
  Cortex-A15 / Cortex-A7 Cortex-A76 / Cortex-A55
• Technology
  28 nm 7 nm
• Socket
  N/A N/A
• Release date
  Q3/2014 Q3/2019