HiSilicon Kirin 920 vs Intel Atom x7-Z8750. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  HiSilicon Kirin Intel Atom
• Generation
  2 1
• CPU group
  HiSilicon Kirin 920 Intel Atom x3/x5/x7

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.30 GHz 1.60 GHz
• CPU Cores
  8 4
• Turbo (1 Core)
  1.70 GHz 2.56 GHz
• CPU Threads
  8 4
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) normal
• A core
  4x Cortex-A15 --
• B core
  4x Cortex-A7 --

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-T628 MP4 Intel HD Graphics 405 (16EU)
• GPU frequency
  0.60 GHz 0.20 GHz
• GPU (Turbo)
  0.60 GHz 0.60 GHz
• Execution units
  4 16
• Shader
  64 128
• Max. GPU Memory
  -- 8 GB
• Max. displays
  1 3
• Generation
  Midgard 2 8
• DirectX Version
  11 12
• Technology
  32nm 14 nm
• Release date
  Q4/2012 Q2/2015

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  No No
• h265 / HEVC (10 bit)
  No No
• h264
  Decode / Encode Decode / Encode
• VP9
  No No
• VP8
  Decode / Encode Decode
• AV1
  No No
• AVC
  No Decode / Encode
• VC-1
  No Decode
• JPEG
  No Decode

Types, channel quantity of RAM supported by Intel Atom x7-Z8750 and HiSilicon Kirin 920. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR3-1600 LPDDR3-1600
• ECC
  No No
• Memory channels
  2 2
• PCIe version
  2.0
• PCIe lanes
  2

• AES-NI
  No Yes

Compare the TDP requirements of TDP HiSilicon Kirin 920 and Intel Atom x7-Z8750 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  2 W

Architecture, interfaces, additional instructions supported by HiSilicon Kirin 920 and HiSilicon Kirin 920, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv7-A32 (32 bit) x86-64 (64 bit)
• Virtualization
  None VT-x, VT-x EPT
• ISA extensions
  SSE4.1, SSE4.2
• L3-Cache
  -- 2.00 MB
• Architecture
  Cortex-A15 / Cortex-A7 Cherry Trail
• Technology
  28 nm 14 nm
• Socket
  N/A BGA 138
• Release date
  Q3/2014 Q1/2016