AMD A4-1200 vs HiSilicon Kirin 9000. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  AMD A4-1000 HiSilicon Kirin 9000
• Family
  AMD A HiSilicon Kirin
• Generation
  7 9
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  - 1x Cortex-A77
• B-Core
  - 3x Cortex-A77
• Base Frequency
  1 GHz 2.05 GHz
• C-Core
  - 4x Cortex-A55
• Core architecture
  normal hybrid (Prime / big.LITTLE)
• CPU Cores
  2 8
• CPU Threads
  2 8
• Hyperthreading / SMT
  No No
• Overclocking
  Yes No
• Turbo Frequency (1 Core)
  No turbo 3.13 GHz
• Turbo Frequency (2 Cores)
  No turbo -
• Turbo Frequency (8 Cores)
  - 2.54 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  11.1 12
• Execution units
  2 24
• Generation
  5 Vallhall 2
• GPU Frequency
  230 MHz 760 MHz
• GPU name
  AMD Radeon HD 8180 ARM Mali-G78 MP24
• GPU Turbo
  No turbo No turbo
• Max. displays
  2 1
• Max. GPU Memory
  2 GB -
• Release date
  Q2/2013 Q4/2020
• Shader
  128 384
• Technology
  28 nm 5 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No Decode
• H.264 / AVC
  Decode Decode / Encode
• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 9000 and AMD A4-1200. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Memory channels
  2 4
• Memory type
  DDR3L-1066 SO-DIMM LPDDR4X-2133LPDDR5-2750

• AES-NI
  Yes No

Compare the TDP requirements of TDP AMD A4-1200 and HiSilicon Kirin 9000 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• TDP (PL1, legacy label)
  3.9 W -

Architecture, interfaces, additional instructions supported by AMD A4-1200 and HiSilicon Kirin 9000, virtual machine technologies and process technology.

• Architecture
  Temash (Jaguar) Cortex-A77 / Cortex-A55
• Instruction set (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• ISA extensions
  SSE4a, SSE4.1, SSE4.2, AVX, FMA3, FMA4 -
• L3-Cache
  1 MB -
• Release date
  Q2/2013 Q4/2020
• Socket
  FT3 -
• Technology
  28 nm 5 nm
• Virtualization
  AMD-V None