Qualcomm Snapdragon 8c vs Intel Core i7-1180G7. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Qualcomm Snapdragon Intel Core i7
• CPU group
  Qualcomm Snapdragon 8c Intel Core i 1100G/11000U
• Segment
  Mobile Mobile
• Generation
  3 11

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Core architecture
  hybrid (big.LITTLE) normal
• Frequency
  1.80 GHz 2.20 GHz
• Turbo (1 Core)
  2.45 GHz 4.60 GHz
• Hyperthreading
  No Yes
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 675 Intel Iris Xe Graphics 96 (Tiger Lake G7)
• GPU frequency
  0.25 GHz 0.40 GHz
• GPU (Turbo)
  0.59 GHz 1.10 GHz
• Execution units
  7 96
• Shader
  672 768
• Max. GPU Memory
  4 GB 16 GB
• Max. displays
  1 4
• Generation
  5 12
• Technology
  7 nm 10 nm
• Release date
  Q4/2018 Q3/2020

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode
• VP9
  Decode Decode / Encode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Intel Core i7-1180G7 and Qualcomm Snapdragon 8c. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-4266 LPDDR4X-4266
• Max. Memory
  16 GB 64 GB
• Memory channels
  4 2
• ECC
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 8c and Intel Core i7-1180G7 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W 15 W
• TDP down
  -- 7 W
• Tjunction max.
  -- 100 °C

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 8c and Qualcomm Snapdragon 8c, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4.1, SSE4.2, AVX2, AVX-512
• L2-Cache
  2.00 MB 5.00 MB
• L3-Cache
  3.00 MB 12.00 MB
• Architecture
  Kryo 490 Tiger Lake U
• Technology
  7 nm 10 nm
• Virtualization
  None VT-x, VT-x EPT, VT-d
• Socket
  N/A BGA 1526
• Release date
  Q4/2019 Q1/2021