Qualcomm Snapdragon 8 Gen 1 vs Intel Core i7-1165G7. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Qualcomm Snapdragon Intel Core i7
• CPU group
  Qualcomm Snapdragon 8 Gen 1 Intel Core i 1100G/11000U
• Segment
  Mobile Mobile
• Generation
  1 11
• Predecessor
  Qualcomm Snapdragon 888 --

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Core architecture
  hybrid (Prime / big.LITTLE) normal
• Frequency
  1.80 GHz 2.80 GHz
• Turbo (1 Core)
  3.00 GHz 4.70 GHz
• Hyperthreading
  No Yes
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 730 Intel Iris Xe Graphics 96 (Tiger Lake G7)
• GPU frequency
  0.84 GHz 0.40 GHz
• GPU (Turbo)
  No turbo 1.30 GHz
• Execution units
  -- 96
• Shader
  -- 768
• Max. GPU Memory
  -- 16 GB
• Max. displays
  -- 4
• Generation
  7 12
• Technology
  4 nm 10 nm
• Release date
  Q1/2022 Q3/2020

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode
• VP9
  Decode / Encode Decode / Encode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Intel Core i7-1165G7 and Qualcomm Snapdragon 8 Gen 1. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR5-3200 DDR4-3200
• Max. Memory
  16 GB 64 GB
• Memory channels
  4 2
• ECC
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 8 Gen 1 and Intel Core i7-1165G7 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  -- 15 W
• TDP (PL2)
  -- 64 W / 28 s
• TDP up
  -- 28 W
• TDP down
  -- 12 W
• Tjunction max.
  -- 100 °C

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 8 Gen 1 and Qualcomm Snapdragon 8 Gen 1, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv9-A64 (64 bit) x86-64 (64 bit)
• ISA extensions
  -- SSE4.1, SSE4.2, AVX2, AVX-512
• L2-Cache
  2.00 MB 5.00 MB
• L3-Cache
  4.00 MB 12.00 MB
• Architecture
  Kryo Tiger Lake U
• Technology
  4 nm 10 nm
• Virtualization
  None VT-x, VT-x EPT, VT-d
• Socket
  N/A BGA 1526
• Release date
  Q1/2022 Q3/2020
• Part Number
  SM8450 --