Qualcomm Snapdragon 778G vs Intel Core i3-8100. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Desktop / Server
• Family
  Qualcomm Snapdragon Intel Core i3
• Generation
  4 8
• CPU group
  Qualcomm Snapdragon 778 Intel Core i 8000
• Predecessor
  -- Intel Core i3-7100
• Successor
  -- Intel Core i3-9100

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.90 GHz 3.60 GHz
• CPU Cores
  8 4
• Turbo (1 Core)
  2.40 GHz No turbo
• CPU Threads
  8 4
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (Prime / big.LITTLE) normal
• A core
  1x Kryo 670 Prime --
• B core
  3x Kryo 670 Gold --
• C core
  4x Kryo 670 Silver --

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 642L Intel UHD Graphics 630
• GPU frequency
  0.35 GHz
• GPU (Turbo)
  No turbo 1.10 GHz
• Execution units
  4 24
• Shader
  384 192
• Max. GPU Memory
  4 GB 64 GB
• Max. displays
  1 3
• Generation
  5 9.5
• DirectX Version
  12.0 12
• Technology
  6 nm 14 nm
• Release date
  Q2/2021 Q4/2017

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  No No
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Intel Core i3-8100 and Qualcomm Snapdragon 778G. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-2133 DDR4-2400
• Max. Memory
  16 GB 64 GB
• ECC
  No Yes
• Memory channels
  2 2
• PCIe version
  3.0
• PCIe lanes
  16

• AES-NI
  No Yes

Compare the TDP requirements of TDP Qualcomm Snapdragon 778G and Intel Core i3-8100 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  65 W
• Tjunction max.
  -- 100 °C

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 778G and Qualcomm Snapdragon 778G, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• Virtualization
  None VT-x, VT-x EPT, VT-d
• ISA extensions
  SSE4.1, SSE4.2, AVX2
• L3-Cache
  2.00 MB 6.00 MB
• Architecture
  Kryo 670 Coffee Lake S
• Technology
  6 nm 14 nm
• Socket
  N/A LGA 1151-2
• Release date
  Q2/2021 Q4/2017
• Part Number
  SM7325 --