Qualcomm Snapdragon 430 vs MediaTek Helio G80. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Qualcomm Snapdragon Mediatek Helio
• Generation
  3 1
• CPU group
  Qualcomm Snapdragon 430 MediaTek Helio G70/G80

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.40 GHz 1.80 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  1.40 GHz 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  1.40 GHz 1.80 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  normal hybrid (big.LITTLE)
• A core
  -- 2x Cortex-A75
• B core
  -- 6x Cortex-A55

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 505 ARM Mali-G52 MP2
• GPU frequency
  0.45 GHz 0.95 GHz
• GPU (Turbo)
  0.45 GHz No turbo
• Execution units
  0 2
• Shader
  48 32
• Max. displays
  0 2
• Generation
  5 Bifrost 2
• DirectX Version
  11 12
• Technology
  28 nm 16 nm
• Release date
  Q4/2015 Q3/2020

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  No Decode / Encode
• VP8
  No Decode / Encode
• AV1
  No No
• AVC
  No Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by MediaTek Helio G80 and Qualcomm Snapdragon 430. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR3-800 LPDDR4X-1800
• Max. Memory
  8 GB
• ECC
  No No
• Memory channels
  1 2
• PCIe version
  --
• PCIe lanes
  --

• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 430 and MediaTek Helio G80 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 430 and Qualcomm Snapdragon 430, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• ISA extensions
  --
• Architecture
  Cortex-A53 Cortex-A75 / Cortex-A55
• Technology
  28 nm 12 nm
• Socket
  N/A N/A
• Release date
  Q2/2016 Q2/2020
• Part Number
  MSM8937 MT6769T