MediaTek Dimensity 720 vs Qualcomm Snapdragon 8cx Gen. 2. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Mediatek Dimensity Qualcomm Snapdragon
• Generation
  1 3
• CPU group
  MediaTek Dimensity 700/720/800 Qualcomm Snapdragon 8cx

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  2.00 GHz 1.80 GHz
• Turbo (1 Core)
  2.00 GHz 2.84 GHz
• Turbo (8 Cores)
  2.00 GHz 2.84 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-G57 MP3 Qualcomm Adreno 690
• GPU frequency
  0.85 GHz 0.25 GHz
• GPU (Turbo)
  No turbo 0.59 GHz
• Execution units
  3 0
• Shader
  48 0
• Max. GPU Memory
  4 GB --
• Max. displays
  2 0
• Generation
  Vallhall 1 6
• Technology
  7 nm 7 nm
• Release date
  Q2/2020 Q4/2020

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Decode No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 8cx Gen. 2 and MediaTek Dimensity 720. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-2133 LPDDR4X-2133
• Max. Memory
  12 GB
• ECC
  No No
• Memory channels
  2 8

Compare the TDP requirements of TDP MediaTek Dimensity 720 and Qualcomm Snapdragon 8cx Gen. 2 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W

Architecture, interfaces, additional instructions supported by MediaTek Dimensity 720 and MediaTek Dimensity 720, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L3-Cache
  -- 2.00 MB
• Architecture
  Cortex-A76 / Cortex-A55 Kryo 495
• Technology
  7 nm 7 nm
• Socket
  N/A N/A
• Release date
  Q3/2020 Q4/2018
• Part Number
  MT6853V/ZA MT6853V/NZA --