MediaTek Dimensity 7020 vs Qualcomm Snapdragon 850. Specifications

Background information about the processors being compared, series, generation and market segment.

• CPU group
  MediaTek Dimensity 7000 Qualcomm Snapdragon 845
• Family
  Mediatek Dimensity Qualcomm Snapdragon
• Generation
  1 5
• Segment
  Mobile Mobile

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  2x Cortex-A76 4x Kryo 385 Gold
• A-Core Frequency
  2.2 GHz -
• B-Core
  6x Cortex-A55 4x Kryo 385 Silver
• B-Core Frequency
  2 GHz -
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• CPU Cores
  8 8
• CPU Threads
  8 8
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• Base Frequency
  - 1.8 GHz
• Turbo Frequency (1 Core)
  - 2.95 GHz
• Turbo Frequency (8 Cores)
  - 2.95 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  - 11
• Execution units
  0 0
• Generation
  11 4
• GPU Frequency
  - 700 MHz
• GPU name
  PowerVR IMG BXM-8-256 Qualcomm Adreno 630
• GPU Turbo
  No turbo No turbo
• Max. displays
  0 2
• Max. GPU Memory
  - 8 GB
• Release date
  - Q1/2018
• Shader
  0 256
• Technology
  0 10 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Conflicting source values: Decode / Encode | No Conflicting source values: Decode | Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  No Decode
• VP8
  No Decode
• VP9
  No Decode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 850 and MediaTek Dimensity 7020. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No No
• Max. Memory
  - 8 GB
• Memory Bandwidth
  51.2 GB/s -
• Memory channels
  4 (Quad Channel) 4
• Memory type
  LPDDR4X-2133LPDDR5-3200 LPDDR4X-1866

• AES-NI
  No No

Compare the TDP requirements of TDP MediaTek Dimensity 7020 and Qualcomm Snapdragon 850 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

Architecture, interfaces, additional instructions supported by MediaTek Dimensity 7020 and Qualcomm Snapdragon 850, virtual machine technologies and process technology.

• Architecture
  Cortex-A715 / Cortex-A510 Kryo 385
• Chip design
  Chiplet -
• Documents
  Technical data sheet -
• Instruction set (ISA)
  ARMv9-A64 (64 bit) ARMv8-A64 (64 bit)
• Operating systems
  Android -
• Part Number
  - SDM850
• Release date
  Q1/2023 Q3/2018
• Technology
  4 nm 10 nm
• Virtualization
  None None