Intel Xeon W-3175X vs MediaTek Dimensity 1100. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Desktop / Server Mobile
• Family
  Intel Xeon W Mediatek Dimensity
• Generation
  6 2
• CPU group
  Intel Xeon W-2100/3100 MediaTek Dimensity 1100/1200
• Successor
  Intel Xeon W-3275 --

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  3.10 GHz 2.00 GHz
• CPU Cores
  28 8
• Turbo (1 Core)
  3.80 GHz 2.60 GHz
• CPU Threads
  56 8
• Hyperthreading
  Yes No
• Overclocking
  Yes No
• Core architecture
  normal hybrid (big.LITTLE)
• A core
  -- 4x Cortex-A78
• B core
  -- 4x Cortex-A55

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  no iGPU ARM Mali-G77 MP9
• GPU frequency
  0.85 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  9
• Shader
  144
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1
• Generation
  Vallhall 1
• DirectX Version
  12
• Technology
  7 nm
• Release date
  Q2/2019

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  No Decode / Encode
• VP9
  No Decode / Encode
• VP8
  No Decode / Encode
• AV1
  No Decode
• AVC
  No Decode / Encode
• VC-1
  No Decode / Encode
• JPEG
  No Decode / Encode

Types, channel quantity of RAM supported by MediaTek Dimensity 1100 and Intel Xeon W-3175X. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  DDR4-2666 LPDDR4X-2133
• Max. Memory
  512 GB
• ECC
  Yes No
• Memory channels
  6 4
• PCIe version
  3.0
• PCIe lanes
  48

• AES-NI
  Yes No

Compare the TDP requirements of TDP Intel Xeon W-3175X and MediaTek Dimensity 1100 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  255 W
• Tjunction max.
  85 °C --

Architecture, interfaces, additional instructions supported by Intel Xeon W-3175X and Intel Xeon W-3175X, virtual machine technologies and process technology.

• Instruction set (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  VT-x, VT-x EPT, VT-d None
• ISA extensions
  SSE4.1, SSE4.2, AVX2, AVX-512
• L3-Cache
  38.50 MB --
• Architecture
  Skylake W Cortex-A78 / Cortex-A55
• Technology
  14 nm 6 nm
• Socket
  LGA 3647 N/A
• Release date
  Q4/2018 Q1/2021
• Part Number
  -- MT6891Z/CZA