Intel Core i3-7100 vs HiSilicon Kirin 9000. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Desktop / Server Mobile
• Family
  Intel Core i3 HiSilicon Kirin
• Generation
  7 9
• CPU group
  Intel Core i 7000 HiSilicon Kirin 9000
• Predecessor
  Intel Core i3-6100 --
• Successor
  Intel Core i3-8100 --

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  3.90 GHz 2.05 GHz
• CPU Cores
  2 8
• Turbo (1 Core)
  No turbo 3.13 GHz
• CPU Threads
  4 8
• Hyperthreading
  Yes No
• Overclocking
  No No
• Core architecture
  normal hybrid (Prime / big.LITTLE)
• A core
  -- 1x Cortex-A77
• B core
  -- 3x Cortex-A77
• C core
  -- 4x Cortex-A55

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Intel HD Graphics 630 ARM Mali-G78 MP24
• GPU frequency
  0.35 GHz 0.76 GHz
• GPU (Turbo)
  1.10 GHz No turbo
• Execution units
  24 24
• Shader
  192 384
• Max. GPU Memory
  64 GB --
• Max. displays
  3 1
• Generation
  9.5 Vallhall 2
• DirectX Version
  12 12
• Technology
  14 nm 5 nm
• Release date
  Q2/2016 Q4/2020

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  No Decode
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by HiSilicon Kirin 9000 and Intel Core i3-7100. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  DDR4-2400 LPDDR4X-2133LPDDR5-2750
• ECC
  No No
• Memory channels
  2 4
• PCIe version
  3.0
• PCIe lanes
  16

• AES-NI
  Yes No

Compare the TDP requirements of TDP Intel Core i3-7100 and HiSilicon Kirin 9000 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  51 W

Architecture, interfaces, additional instructions supported by Intel Core i3-7100 and Intel Core i3-7100, virtual machine technologies and process technology.

• Instruction set (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  VT-x, VT-x EPT, VT-d None
• ISA extensions
  SSE4.1, SSE4.2, AVX2
• L3-Cache
  3.00 MB --
• Architecture
  Kaby Lake S Cortex-A77 / Cortex-A55
• Technology
  14 nm 5 nm
• Socket
  LGA 1151 N/A
• Release date
  Q1/2017 Q4/2020