AMD Ryzen 3 3200U vs Qualcomm Snapdragon 7c. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  AMD Ryzen 3000U Qualcomm Snapdragon 7c
• Family
  Ryzen Qualcomm Snapdragon
• Form Factor
  Laptops / Desktops -
• Generation
  2 2
• Segment
  Mobile Mobile
• Series
  Ryzen 3000 Series -
• Successor
  - Qualcomm Snapdragon 7c Gen 2

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  - 2x Kryo 468 Gold
• B-Core
  - 6x Kryo 468 Silver
• Base Frequency
  2.6 GHz 2.4 GHz
• Core architecture
  normal hybrid (big.LITTLE)
• CPU Cores
  2 8
• CPU Threads
  4 8
• Hyperthreading / SMT
  Yes No
• Max. Boost Clock
  3.5 GHz -
• Overclocking
  No No
• Turbo Frequency (1 Core)
  3.5 GHz 2.4 GHz
• Turbo Frequency (2 Cores)
  2.6 GHz -
• Turbo Frequency (8 Cores)
  - 2.4 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12 12.1
• Execution units
  3 0
• Generation
  8 6
• GPU Frequency
  1200 MHz 700 MHz
• GPU name
  Radeon Vega 3 Graphics Qualcomm Adreno 618
• GPU Turbo
  No turbo No turbo
• Graphics Cores
  3 -
• Max. displays
  3 2
• Max. GPU Memory
  2 GB 4 GB
• Release date
  Q1/2018 Q2/2019
• Shader
  192 128
• Technology
  14 nm 14 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Decode / Encode Conflicting source values: Decode | Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode
• VC-1
  Decode Decode
• VP8
  Decode / Encode Decode
• VP9
  Decode / Encode Decode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 7c and AMD Ryzen 3 3200U. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  Yes No
• Max. Memory
  32 GB -
• Memory channels
  2 2
• Memory type
  DDR4-2400 LPDDR4X-2133
• PCIe
  PCIe 3.0 -
• PCIe lanes
  12 -
• PCIe version
  3.0 -
• System Memory Specification
  2400 -

• AES-NI
  Yes No

Compare the TDP requirements of TDP AMD Ryzen 3 3200U and Qualcomm Snapdragon 7c Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• Configurable TDP
  12-25 W -
• Default TDP
  15 W -
• Maximum Operating Temperature
  105 °C -
• TDP (PL1, legacy label)
  15 W -
• TDP down
  12 W -
• TDP up
  25 W -

Architecture, interfaces, additional instructions supported by AMD Ryzen 3 3200U and Qualcomm Snapdragon 7c, virtual machine technologies and process technology.

• Architecture
  Dali (Zen+) Kryo 468
• Codename
  Picasso -
• Instruction set (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• ISA extensions
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 -
• L1-Cache
  0.1875 MB -
• L2-Cache
  1 MB -
• L3-Cache
  4 MB -
• Manufacturer product ID (tray)
  YM3200C4T2OFG -
• Operating systems
  Windows 11 - 64-Bit Edition / Windows 10 - 64-Bit Edition / RHEL x86 64-Bit / Ubuntu x86 64-Bit -
• Part Number
  - SC7180
• Release date
  Q1/2019 2020
• Socket
  FP5 -
• Technology
  14nm 8 nm
• Virtualization
  AMD-V, SVM None