AMD EPYC 9754 vs Intel Core i9-13900KS. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  AMD EPYC Intel Core i9
• CPU group
  AMD EPYC 9004 Intel Core i 13000
• Segment
  Desktop / Server Desktop / Server
• Generation
  4 13
• Predecessor
  -- Intel Core i9-12900KS

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  128 / 256 24 / 32
• Core architecture
  normal hybrid (big.LITTLE)
• Hyperthreading / SMT
  Yes Yes
• Overclocking
  No Yes

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  no iGPU Intel UHD Graphics 770
• GPU frequency
  0.30 GHz
• GPU (Turbo)
  No turbo 1.65 GHz
• Execution units
  32
• Shader
  256
• Max. GPU Memory
  -- 64 GB
• Max. displays
  3
• Generation
  11
• Direct X
  -- 12
• Technology
  10 nm
• Release date
  Q4/2021

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  No Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No Decode / Encode
• AV1
  No Decode
• AVC
  No Decode / Encode
• VC-1
  No Decode
• JPEG
  No Decode / Encode

Types, channel quantity of RAM supported by Intel Core i9-13900KS and AMD EPYC 9754. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  DDR5-4800 DDR4-3200DDR5-5600
• Max. Memory
  6144 GB 128 GB
• Memory channels
  12 2 (Dual Channel)
• Bandwidth
  461.0 GB/s 89.6 GB/s
• ECC
  Yes Yes
• PCIe
  5.0 x 128 5.0 x 20
• AES-NI
  Yes Yes

Compare the TDP requirements of TDP AMD EPYC 9754 and Intel Core i9-13900KS to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL2)
  -- 253 W
• TDP up
  400 W --
• TDP down
  320 W --
• Tjunction max.
  100 °C 100 °C

Architecture, interfaces, additional instructions supported by AMD EPYC 9754 and AMD EPYC 9754, virtual machine technologies and process technology.

• Technology
  5 nm 10 nm
• Chip design
  Chiplet Monolithic
• Socket
  SP5 LGA 1700
• L2-Cache
  -- 32.00 MB
• L3-Cache
  256.00 MB 36.00 MB
• Architecture
  Bergamo (Zen 4c) Raptor Lake S
• Operating systems
  Windows Server 2022, Linux, Windows 11 Windows 10, Windows 11, Linux
• Virtualization
  AMD-V, SVM VT-x, VT-x EPT, VT-d
• Instruction set (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4.2, AVX2, AVX-512, BFLOAT16, VNNI SSE4.1, SSE4.2, AVX2, AVX2+
• Release date
  Q2/2023 Q1/2023
• Release price
  11900 $ --
• Documents
  Technical data sheet --