UNISOC T760 vs Qualcomm Snapdragon 7c Gen 2. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  UNISOC 5G Qualcomm Snapdragon
• CPU group
  UNISOC 5G 6nm Qualcomm Snapdragon 7c
• Segment
  Mobile Mobile
• Generation
  0 2
• Predecessor
  -- Qualcomm Snapdragon 7c

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  8 / 8 8 / 8
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  4x Cortex-A76 2x Kryo 468 Gold
• B-Core
  4x Cortex-A55 6x Kryo 468 Silver
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  ARM Mali-G57 MP4 Qualcomm Adreno 618
• GPU frequency
  0.65 GHz 0.70 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  4 0
• Shader
  64 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Generation
  Vallhall 1 6
• Direct X
  12 12.1
• Technology
  7 nm 14 nm
• Release date
  Q2/2020 Q2/2019

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode
• VP9
  Decode / Encode Decode
• AV1
  Decode No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 7c Gen 2 and UNISOC T760. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-2133 LPDDR4X-2133
• Memory channels
  2 (Dual Channel) 2
• ECC
  No No
• AES-NI
  No No

Compare the TDP requirements of TDP UNISOC T760 and Qualcomm Snapdragon 7c Gen 2 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

Architecture, interfaces, additional instructions supported by UNISOC T760 and UNISOC T760, virtual machine technologies and process technology.

• Technology
  6 nm 8 nm
• Socket
  -- N/A
• Architecture
  Kryo 468
• Virtualization
  None None
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Release date
  Q2/2021 Q2/2021
• Part Number
  -- SC7180P