UNISOC T310 vs MediaTek Dimensity 9200. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  UNISOC 4G Mediatek Dimensity
• CPU group
  UNISOC 4G 12nm MediaTek Dimensity 9200
• Segment
  Mobile Mobile
• Generation
  0 4
• Predecessor
  -- MediaTek Dimensity 9000+

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  4 / 4 8 / 8
• Core architecture
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  1x Cortex-A75 1x Cortex-X3
• B-Core
  3x Cortex-A55 3x Cortex-A710
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• A-Core Frequency
  2.00 GHz 3.05 GHz
• B-Core Frequency
  1.80 GHz 2.85 GHz

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  PowerVR GE8300 ARM Immortalis-G715 MP11
• GPU frequency
  0.80 GHz 0.90 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  1 11
• Shader
  0 --
• Max. displays
  1 --
• Generation
  Vallhall
• Direct X
  10 12
• Technology
  20 nm 4 nm
• Release date
  Q1/2017 Q4/2022

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  No Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No Decode / Encode
• AV1
  No Decode
• AVC
  No Decode / Encode
• VC-1
  No Decode / Encode
• JPEG
  No Decode / Encode

Types, channel quantity of RAM supported by MediaTek Dimensity 9200 and UNISOC T310. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR3-933LPDDR4-1333LPDDR4X-1333 LPDDR5X-8533
• Max. Memory
  --
• Memory channels
  0 4 (Quad Channel)
• Bandwidth
  -- 68.0 GB/s
• ECC
  No No
• PCIe
  --
• AES-NI
  No No

Compare the TDP requirements of TDP UNISOC T310 and MediaTek Dimensity 9200 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

Architecture, interfaces, additional instructions supported by UNISOC T310 and UNISOC T310, virtual machine technologies and process technology.

• Technology
  12 nm 4 nm
• Chip design
  Chiplet
• Socket
  -- N/A
• Architecture
  Cortex-X3 / -A715 / -A510
• Operating systems
  Android Android
• Virtualization
  None None
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• ISA extensions
  --
• Release date
  Q2/2019 Q4/2022
• Documents
  Technical data sheet --