Qualcomm Snapdragon 860 vs Intel Core i3-4130. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• CPU group
  Qualcomm Snapdragon 855/860 Intel Core i 4000
• Family
  Qualcomm Snapdragon Intel Core i3
• Generation
  6 4
• Predecessor
  Qualcomm Snapdragon 855+ -
• Segment
  Mobile Desktop / Server

Core counts, threads, cache and clock modes describe the CPU configuration. Performance depends on the workload and comparable measured results.

• A-Core
  1x Kryo 485 Prime -
• B-Core
  3x Kryo 485 Gold -
• Base Frequency
  1.8 GHz 3.4 GHz
• C-Core
  4x Kryo 485 Silver -
• Core architecture
  hybrid (Prime / big.LITTLE) normal
• CPU Cores
  8 2
• CPU Threads
  8 4
• Hyperthreading / SMT
  No Yes
• Overclocking
  No No
• Turbo Frequency (1 Core)
  2.96 GHz No turbo
• Turbo Frequency (8 Cores)
  2.42 GHz -
• Turbo Frequency (2 Cores)
  - No turbo

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• DirectX Version
  12.0 11.1
• Execution units
  4 20
• Generation
  5 7.5
• GPU Frequency
  250 MHz 350 MHz
• GPU name
  Qualcomm Adreno 640 Intel HD Graphics 4400
• GPU Turbo
  680 MHz 1150 MHz
• Max. displays
  1 3
• Max. GPU Memory
  4 GB 2 GB
• Release date
  Q1/2019 Q2/2013
• Shader
  384 160
• Technology
  7 nm 22 nm

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• AV1
  No No
• H.264 / AVC
  Conflicting source values: Decode / Encode | No Decode / Encode
• h265 / HEVC (8 bit)
  Decode / Encode No
• h265 / HEVC (10 bit)
  Decode / Encode No
• JPEG
  No Decode
• VC-1
  No Decode
• VP8
  Decode / Encode No
• VP9
  Decode / Encode No

Types, channel quantity of RAM supported by Intel Core i3-4130 and Qualcomm Snapdragon 860. Depending on the motherboards, higher or lower memory frequencies may be supported.

• ECC
  No Yes
• Max. Memory
  16 GB 32 GB
• Memory channels
  4 2
• Memory type
  LPDDR4X-2133 DDR3-1333DDR3-1600DDR3L-1333 SO-DIMMDDR3L-1600 SO-DIMM
• PCIe lanes
  - 16
• PCIe version
  - 3.0

• AES-NI
  No Yes

Compare the TDP requirements of TDP Qualcomm Snapdragon 860 and Intel Core i3-4130 Power specifications describe different manufacturer limits. TDP, base power and maximum turbo power are separate values; they do not establish measured system consumption.

• Maximum Operating Temperature
  - 100 °C
• TDP (PL1, legacy label)
  - 54 W

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 860 and Intel Core i3-4130, virtual machine technologies and process technology.

• Architecture
  Kryo 485 Haswell S
• Instruction set (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• ISA extensions
  - SSE4.1, SSE4.2, AVX2
• L2-Cache
  2 MB -
• L3-Cache
  3 MB 3 MB
• Part Number
  SM8150-AC -
• Release date
  Q1/2021 Q3/2013
• Socket
  - LGA 1150
• Technology
  7 nm 22 nm
• Virtualization
  None VT-x, VT-x EPT, VT-d