Qualcomm Snapdragon 855 vs Intel Core i5-7Y57. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Segment
  Mobile Mobile
• Family
  Qualcomm Snapdragon Intel Core M
• Generation
  6 7
• CPU group
  Qualcomm Snapdragon 855/860 Intel Core i 7Y

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• Frequency
  1.80 GHz 1.20 GHz
• CPU Cores
  8 2
• Turbo (1 Core)
  2.84 GHz 3.30 GHz
• CPU Threads
  8 4
• Hyperthreading
  No Yes
• Overclocking
  No No
• Core architecture
  hybrid (Prime / big.LITTLE) normal
• A core
  1x Kryo 485 Prime --
• B core
  3x Kryo 485 Gold --
• C core
  4x Kryo 485 Silver --

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 640 Intel HD Graphics 615
• GPU frequency
  0.25 GHz 0.30 GHz
• GPU (Turbo)
  0.59 GHz 0.95 GHz
• Execution units
  4 24
• Shader
  384 192
• Max. GPU Memory
  4 GB 16 GB
• Max. displays
  1 3
• Generation
  5 9.5
• DirectX Version
  12.0 12
• Technology
  7 nm 14nm
• Release date
  Q1/2019 Q2/2016

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  No No
• AVC
  No Decode / Encode
• VC-1
  No Decode
• JPEG
  No Decode / Encode

Types, channel quantity of RAM supported by Intel Core i5-7Y57 and Qualcomm Snapdragon 855. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR4X-4266 DDR3L-1600 SO-DIMMLPDDR3-1866
• Max. Memory
  16 GB 16 GB
• ECC
  No No
• Memory channels
  4 2
• PCIe version
  3.0
• PCIe lanes
  10

• AES-NI
  No Yes

Compare the TDP requirements of TDP Qualcomm Snapdragon 855 and Intel Core i5-7Y57 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  4.5 W
• TDP up
  -- 7 W
• TDP down
  -- 3.5 W
• Tjunction max.
  -- 100 °C

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 855 and Qualcomm Snapdragon 855, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• Virtualization
  None VT-x, VT-x EPT, VT-d
• ISA extensions
  SSE4.1, SSE4.2, AVX2
• L2-Cache
  2.00 MB --
• L3-Cache
  3.00 MB 4.00 MB
• Architecture
  Kryo 485 Kaby Lake Y
• Technology
  7 nm 14 nm
• Socket
  N/A BGA 1515
• Release date
  Q4/2018 Q1/2017
• Part Number
  SM8150 --