Qualcomm Snapdragon 808 vs Qualcomm Snapdragon 765. Specifications, performance, tests

Background information about the processors being compared, series, generation and market segment.

• Family
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPU group
  Qualcomm Snapdragon 808/810 Qualcomm Snapdragon 760
• Segment
  Mobile Mobile
• Generation
  2 3

Basic parameters such as number of cores, number of threads, base and turbo frequency, and cache size. These parameters indirectly tell about the speed of the processor, the higher they are the better.

• CPU Cores / Threads
  6 / 6 8 / 8
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  2x Cortex-A57 1x Kryo 475 Prime
• B-Core
  4x Cortex-A53 1x Kryo 475 Gold
• C-Core
  -- 6x Kryo 475 Silver
• Frequency
  1.44 GHz 1.80 GHz
• Turbo (1 Core)
  1.82 GHz 2.30 GHz
• Hyperthreading
  No No
• Overclocking
  No No

Internal Graphics does not affect the performance of the CPU, performs the work of the graphics card in its absence or on mobile devices.

• GPU name
  Qualcomm Adreno 418 Qualcomm Adreno 620
• GPU frequency
  0.60 GHz 0.63 GHz
• GPU (Turbo)
  0.60 GHz No turbo
• Shader
  128 192
• Max. GPU Memory
  -- 4 GB
• Max. displays
  0 2
• Generation
  4 6
• Direct X
  11 12.1
• Technology
  20 nm 7 nm
• Release date
  Q2/2014 Q2/2019

Built-in codecs used to encode and decode content. Significantly speeds up the required operations.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  No Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  No Decode
• VP9
  No Decode
• AV1
  No No
• AVC
  No Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Types, channel quantity of RAM supported by Qualcomm Snapdragon 765 and Qualcomm Snapdragon 808. Depending on the motherboards, higher or lower memory frequencies may be supported.

• Memory type
  LPDDR3-933 LPDDR4-3733
• Max. Memory
  8 GB
• Memory channels
  2 2
• ECC
  No No
• AES-NI
  No No

Compare the TDP requirements of TDP Qualcomm Snapdragon 808 and Qualcomm Snapdragon 765 to select a cooling system. Note, the TDP value refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Architecture, interfaces, additional instructions supported by Qualcomm Snapdragon 808 and Qualcomm Snapdragon 808, virtual machine technologies and process technology.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  -- 2.00 MB
• Architecture
  Cortex-A57 / Cortex-A53 Kryo 475
• Technology
  20 nm 7 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q3/2014 Q3/2020
• Part Number
  MSM8992 SM7250-AA